The copper substrate is polished to remove surface oxides and impurities. Then, the copper substrate is soaked in the detergent to make its surface clean and free of impurities. Finally, rinse the copper substrate with pure water. Then there is the tinning process. First, the treated copper substrate is placed into the copper plating tank.

In the copper plating tank, copper ions are released from the anode and deposited on the surface of the copper substrate through the action of the power supply. The time and voltage of tinning need to be adjusted according to the specific situation to ensure that the quality and thickness of copper coating meet the requirements