Chemical nickel-palladium equipment deposits a layer of nickel, palladium and gold alloy on the copper surface of the PCB through a series of chemical reactions, which has provided good solderability, electrical conductivity and corrosion resistance

Chemical nickel-palladium equipment is a equipment for plating nickel, nickel-palladium alloy and gold on metal surfaces. Chemical nickel is a method of depositing a nickel layer on a metal surface using an electrochemical reaction. In chemical nickel-palladium equipment, by placing the metal in an electrolyte containing nickel salts and other additives, a layer of nickel can be uniformly deposited on the surface of the metal through the action of an electric current, thereby improving the corrosion resistance and wear resistance of the metal